US Patent Issued to Kokusai Electric on July 14 for "Nozzle cleaning method, substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,680,160, issued on July 14, was assigned to Kokusai Electric Corp. (Tokyo).

"Nozzle cleaning method, substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium" was invented by Takeo Hanashima (Toyama, Japan), Kazuhiro Harada (Toyama, Japan) and Takuro Ushida (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique capable of effectively removing a residual element after a cleaning process. According to one aspect of the technique, there is provided a method of manufacturing a semiconductor device, including: (a) supply...