US Patent Issued to KOKUSAI ELECTRIC on Feb. 3 for "Conversion pipe arrangement, substrate processing apparatus, method of processing substrate, and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,695, issued on Feb. 3, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Conversion pipe arrangement, substrate processing apparatus, method of processing substrate, and method of manufacturing semiconductor device" was invented by Takuto Shoji (Toyama, Japan), Ryosuke Takahashi (Toyama, Japan) and Masakazu Sakata (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: a first connector including a first opening including two longitudinally extending parallel sides and configured to provide a detachable connection to an opening of a first counterpart; and a second connector including a substantially c...