US Patent Issued to KOKUSAI ELECTRIC on Feb. 24 for "Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,981, issued on Feb. 24, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device" was invented by Hideki Horita (Toyama, Japan), Haojie Kang (Toyama, Japan) and Masanao Osanai (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique that includes: forming a film on a substrate in a process chamber by performing a cycle a predetermined number of times, the cycle including non-simultaneously performing: (a) supplying a precursor from a first supplier to the substrate and exhausting the precursor ...