US Patent Issued to KOKUSAI ELECTRIC on Dec. 30 for "Method of manufacturing semiconductor device, substrate processing apparatus and evaporation system" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,509,768, issued on Dec. 30, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Method of manufacturing semiconductor device, substrate processing apparatus and evaporation system" was invented by Kosuke Takagi (Toyama, Japan) and Yuji Takebayashi (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An amount of particles generated when a source material is used is suppressed. A substrate is loaded into a process chamber, and the source material is sequentially flowed into an evaporator, and a mist filter constituted by assembling a plurality of at least two types of plates including holes disposed at different positions to be evaporated and suppl...