US Patent Issued to KOKUSAI ELECTRIC on Aug. 25 for "Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording medium capable of determining presence or absence of substrate" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,100, issued on Aug. 25, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device and non-transitory computer-readable recording medium capable of determining presence or absence of substrate" was invented by Naoki Hara (Toyama, Japan), Tomihiro Amano (Toyama, Japan) and Shin Hiyama (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to the present disclosure, there is provided a technique capable of suppressing an erroneous detection of a presence or absence of a substrate caused by a light receiver receiving a specularly reflected l...