US Patent Issued to KOKUSAI ELECTRIC on Aug. 25 for "Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,650, issued on Aug. 25, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo).

"Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" was invented by Katsuhiko Yamamoto (Toyama, Japan), Keishin Yamazaki (Toyama, Japan), Shinya Sasaki (Toyama, Japan) and Noriaki Michita (Toyama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a technique, which includes: a process chamber where a substrate is processed; a microwave oscillator configured to supply microwaves to the process chamber; and a controller configured to be capable of controlling the microwave oscillator to perform: a heating proces...