US Patent Issued to KOH YOUNG TECHNOLOGY on July 14 for "Device and method for optimizing control parameter of solder printing apparatus" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,678,880, issued on July 14, was assigned to KOH YOUNG TECHNOLOGY INC. (Seoul, South Korea).

"Device and method for optimizing control parameter of solder printing apparatus" was invented by Guk Han (Ansan-si, South Korea), Jae Hwan Lee (Seoul, South Korea), Duk Young Lee (Suwon-si, South Korea) and Chan Woo Park (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic apparatus according to various embodiments of the present disclosure may include: a communication circuit that is communicatively connected to a solder printing apparatus and a measurement apparatus; one or more memories; and one or more processors. One or more proc...