US Patent Issued to KLA on July 7 for "Non-reagent chloride analysis in acid copper plating baths" (New Jersey, New York Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,674,775, issued on July 7, was assigned to KLA Corp. (Milpitas, Calif.).

"Non-reagent chloride analysis in acid copper plating baths" was invented by Jingjing Wang (Livingston, N.J.), Patrick Saitta (Brooklyn, N.Y.) and Eugene Shalyt (Washington Township, N.J.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosed subject matter relates to techniques for methods and systems for non-reagent chloride analysis in an acid copper plating bath, using a blend of VMS (Virgin Makeup Solution) to generate Ag+-containing solution as a titration into a sample."

The patent was filed on Oct. 6, 2023, under Application No. 18/482,443.

*For further information, ...