US Patent Issued to Kioxia on Sept. 8 for "Test substrate, test apparatus, and test method for semiconductor integrated circuit" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,142, issued on Sept. 8, was assigned to Kioxia Corp. (Tokyo).

"Test substrate, test apparatus, and test method for semiconductor integrated circuit" was invented by Taisuke Ichikawa (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a test substrate of a semiconductor integrated circuit includes: a substrate connected between a burn-in apparatus and a burn-in board on which a semiconductor integrated circuit which is a device under test is mounted, and a test circuit disposed on the substrate and configured to extend a connection interface configuration between the burn-in apparatus and the burn-in board." ...