US Patent Issued to Kioxia on Sept. 16 for "Semiconductor memory device having a circuit chip bonded to a memory array chip and including a solid-state drive controller and a control circuit" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,419,055, issued on Sept. 16, was assigned to Kioxia Corp. (Tokyo).

"Semiconductor memory device having a circuit chip bonded to a memory array chip and including a solid-state drive controller and a control circuit" was invented by Yoshiaki Fukuzumi (Yokkaichi, Japan), Hideaki Aochi (Yokkaichi, Japan), Mie Matsuo (Yokkaichi, Japan), Kenichiro Yoshii (Bunkyo, Japan), Koichiro Shindo (Yokohama, Japan), Kazushige Kawasaki (Kawasaki, Japan) and Tomoya Sanuki (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, the array chip includes a three-dimensionally disposed plurality of memory cells and a memory-side intercon...