US Patent Issued to Kioxia on Oct. 27 for "Position determining method and manufacturing method of semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,869, issued on Oct. 27, was assigned to Kioxia Corp. (Tokyo).

"Position determining method and manufacturing method of semiconductor device" was invented by Takanobu Ono (Kuwana Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A position determining method according to the present embodiment is a position determining method of a wafer which has a plurality of singulated chips and which is pasted on a tape. In addition, the present position determining method includes irradiating, with light, the wafer which has a first cut mark provided between the chips and a second cut mark with a width that differs from a width of the first cut mark. Fur...