US Patent Issued to Kioxia on March 31 for "Composition, pattern forming method, semiconductor device, and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,173, issued on March 31, was assigned to Kioxia Corp. (Tokyo).

"Composition, pattern forming method, semiconductor device, and method for manufacturing semiconductor device" was invented by Takeshi Higuchi (Yokohama Kanagawa, Japan) and Takahiro Iwasaki (Yokkaichi Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a composition including a compound is provided. The compound includes a linking group containing 2 to 18 carbon atoms, a polymerizable functional group bonded to the linking group, a first reactive group bonded to the linking group, and a second reactive group bonded to the linking group. The polymeriza...