US Patent Issued to Kioxia on March 17 for "Socket board with a socket having heat conductive material disposed on bottom portion of the socket and method for inspecting a semiconductor device mounting in the socket" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,358, issued on March 17, was assigned to Kioxia Corp. (Tokyo).

"Socket board with a socket having heat conductive material disposed on bottom portion of the socket and method for inspecting a semiconductor device mounting in the socket" was invented by Tsunehiro Kita (Fujisawa Kanagawa, Japan) and Soichiro Ibaraki (Yokohama Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A socket board used for testing a semiconductor device having one or more terminals, by raising a temperature of the semiconductor device to a predetermined temperature, includes a substrate, a socket that is provided on the substrate and capable of holding the semic...