US Patent Issued to KIOXIA on March 17 for "Semiconductor manufacturing device and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,920, issued on March 17, was assigned to KIOXIA Corp. (Tokyo).

"Semiconductor manufacturing device and method of manufacturing semiconductor device" was invented by Satoshi Nagai (Yokkaichi Mie, Japan) and Hirofumi Sato (Yokkaichi Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a semiconductor manufacturing device includes a processing chamber that accommodates a substrate, a support that supports the substrate, a nozzle that supplies a resist material onto the substrate, a first temperature regulator, and a second temperature regulator. The first temperature regulator is attached to the support and the second...