US Patent Issued to Kioxia on Dec. 16 for "Substrate processing device, substrate processing method, and method for manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,098, issued on Dec. 16, was assigned to Kioxia Corp. (Tokyo).

"Substrate processing device, substrate processing method, and method for manufacturing semiconductor device" was invented by Tomohiko Sugita (Yokkaichi Mie, Japan), Hiroshi Fujita (Mie Mie, Japan) and Tatsuhiko Koide (Kuwana Mie, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to one embodiment, a substrate processing device includes a processing tank to store a liquid and to permit a plurality of substrates to be immersed in the liquid at the same time. The device also has a holder member configured to hold the plurality of substrates while the substrates are immersed int...