US Patent Issued to Kingtek Elec-Technology on Jan. 20 for "Pre-jig wafer carrier disc installation/uninstallation device and method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,528,652, issued on Jan. 20, was assigned to Kingtek Elec-Technology Co. Ltd. (Zhubei, Taiwan).

"Pre-jig wafer carrier disc installation/uninstallation device and method thereof" was invented by Mao-Yen Sung (Zhubei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pre-jig wafer carrier disc installation/uninstallation device and a method thereof, including a first displacement mechanism, a wafer frame installation/uninstallation mechanism, a wafer installation/uninstallation mechanism, a mask installation/uninstallation mechanism and a robotic arm arranged around the first displacement mechanism. The said mechanisms sequentially stack the wafer f...