US Patent Issued to Kepler Computing on Feb. 24 for "Memory device fabrication through wafer bonding" (American, Belgian Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,737, issued on Feb. 24, was assigned to Kepler Computing Inc. (San Francisco).

"Memory device fabrication through wafer bonding" was invented by Biswajeet Guha (Hillsboro, Ore.), Mauricio Manfrini (Heverlee, Belgium), Noriyuki Sato (Palo Alto, Calif.), James David Clarkson (El Sobrante, Calif.), Abel Fernandez (Berkeley, Calif.), Somilkumar J. Rathi (San Jose, Calif.), Niloy Mukherjee (San Ramon, Calif.), Tanay Gosavi (Portland, Ore.), Amrita Mathuriya (Portland, Ore.), Rajeev Kumar Dokania (Beaverton, Ore.) and Sasikanth Manipatruni (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a device includes forming a mu...