US Patent Issued to Kepler Computing on Aug. 25 for "Method of forming ferroelectric chiplet in a multi-dimensional packaging with I/O switch embedded in a substrate or interposer" (Oregon, California Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,717,479, issued on Aug. 25, was assigned to Kepler Computing Inc. (San Francisco).

"Method of forming ferroelectric chiplet in a multi-dimensional packaging with I/O switch embedded in a substrate or interposer" was invented by Amrita Mathuriya (Portland, Ore.), Christopher B. Wilkerson (Portland, Ore.), Rajeev Kumar Dokania (Beaverton, Ore.), Debo Olaosebikan (San Francisco) and Sasikanth Manipatruni (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A ferroelectric memory chiplet in a multi-dimensional packaging. The multi-dimensional packaging includes a first die comprising a switch and a first plurality of input-output transceivers. The...