ALEXANDRIA, Va., June 2 -- United States Patent no. 12,644,017, issued on June 2, was assigned to KCTECH Co. LTD. (Gyeonggi-do, South Korea).
"Slurry composition for metal polishing" was invented by Jin Sook Hwang (Anseong-si, South Korea), Hyun Goo Kong (Anseong-si, South Korea) and Yun Su Kim (Anseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a slurry composition for metal polishing, comprising: colloidal silica; and an oxidizing agent; and at least one selected from among a polishing catalyst, a metal polishing enhancer, a polishing inhibitor, and a dishing and erosion reducer, wherein the colloidal silica has a particle size distribution of colloidal ...