US Patent Issued to KASAI KOGYO on Sept. 15 for "Molding die, method for manufacturing molding die, and method for manufacturing molded product" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,734,731, issued on Sept. 15, was assigned to KASAI KOGYO Co. LTD. (Kanagawa, Japan).

"Molding die, method for manufacturing molding die, and method for manufacturing molded product" was invented by Nobuaki Seki (Atsugi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A molding die includes: a first mold formed of a steel material, the first mold including a first front surface serving as a contact surface that comes into contact with a molded product, a fine hole penetrating from the first front surface, and a plated layer formed on the first front surface and an inner wall of the fine hole; and a second mold configured to be combined with the fir...