ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,735,569, issued on Sept. 15, was assigned to KANEKA Corp. (Osaka, Japan).
"Resin composition, molded body, and film" was invented by Kohei Ogawa (Settsu, Japan) and Fumiyasu Ishiguro (Settsu, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition including a polyamideimide and an acryl-based resin is provided. The polyamideimide has a diamine-derived structure, a tetracarboxylic-dianhydride-derived structure and a dicarboxylic-acid-derived structure, and contains a structure derived from a fluoroalkyl-substituted benzidine as the diamine-derived structure. A ratio of the dicarboxylic-acid-derived structure relative to the total of the...