US Patent Issued to KANEKA on Feb. 17 for "Multi-layered polyimide film, metal-clad laminate, and method for producing multi-layered polyimide film" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,969, issued on Feb. 17, was assigned to KANEKA Corp. (Osaka, Japan).

"Multi-layered polyimide film, metal-clad laminate, and method for producing multi-layered polyimide film" was invented by Fumiya Kono (Otsu, Japan), Takayoshi Akiyama (Otsu, Japan), Mami Akisada (Otsu, Japan) and Mari Uno (Settsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-layered polyimide film includes a non-thermoplastic polyimide layer, and an adhesive layer that is disposed on at least one surface of the non-thermoplastic polyimide layer and contains polyimide. A dielectric loss tangent of the non-thermoplastic polyimide layer at a frequency of 10 GHz, a tem...