ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,428, issued on Sept. 8, was assigned to JUSUNG ENGINEERING Co. LTD. (South Korea).

"Substrate treatment method" was invented by Jae Wuk So (Gwangju-si, South Korea), Chang Kyun Park (Gwangju-si, South Korea), Hong Min Yoon (Gwangju-si, South Korea), Joo Sung Kim (Gwangju-si, South Korea) and Chul Joo Hwang (Gwangju-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present inventive concept relates to a method for treatment of a substrate having an insulating layer and an electrode layer formed thereon, the method comprising: a plasma treatment step of treating the substrate with plasma by using treatment gas containing fluorine (F);...