US Patent Issued to JSP on March 31 for "Polypropylene-based resin expanded beads and molded article thereof" (Japanese Inventor)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,589,534, issued on March 31, was assigned to JSP Corp. (Tokyo).

"Polypropylene-based resin expanded beads and molded article thereof" was invented by Hisashi Masumoto (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An expanded bead of polypropylene-based resin formed with a through hole that is defined by an inner peripheral surface and that has an average hole diameter of 1 mm or less. The expanded bead has a closed cell content of 85% or more, an average cell diameter of 50 to 300 micro metre and an inner surface portion that extends along the inner peripheral surface that has an average cell diameter of 5 to 150 micro metre which is...