US Patent Issued to JSP on June 9 for "Method for producing polyamide-based resin multi-stage-expanded beads" (Japanese Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,649,837, issued on June 9, was assigned to JSP Corp. (Tokyo).

"Method for producing polyamide-based resin multi-stage-expanded beads" was invented by Tetsu Otsuka (Sapporo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for producing polyamide-based resin multi-stage expanded beads includes an internal pressure applying step of placing polyamide-based resin expanded beads in a pressure-resistant container, impregnating the polyamide-based resin expanded beads with a physical blowing agent in the pressure-resistant container to apply internal pressure higher than atmospheric pressure; and a heating and foaming step of heating and expanding ...