ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,503,597, issued on Dec. 23, was assigned to JSP Corp. (Tokyo).
"Composite molded article" was invented by Hidehiro Sasaki (Kaminokawa-machi, Japan) and Toshio Morita (Tochigi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A composite molded article in which thermoplastic resin expanded beads are bonded via a thermosetting resin binder, wherein the composite molded article has a density of 0.05 to 0.5 g/cm3, and when heated at 100deg C. for 20 minutes, the composite molded article has a volume expansion rate of 15 to 200%."
The patent was filed on Feb. 2, 2021, under Application No. 17/797,648.
*For further information, including images, charts ...