US Patent Issued to JSP on Aug. 4 for "Polyamide-based resin expanded beads, molded article of polyamide-based resin expanded beads, and method for producing polyamide-based resin expanded beads" (Japanese Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,698,374, issued on Aug. 4, was assigned to JSP Corp. (Tokyo).

"Polyamide-based resin expanded beads, molded article of polyamide-based resin expanded beads, and method for producing polyamide-based resin expanded beads" was invented by Tatsuya Hayashi (Yokkaichi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Polyamide-based resin expanded beads contain a polyamide-based resin as a base material resin. The beads have a crystal structure, an intrinsic peak of the polyamide-based resin and a high-temperature peak having a peak top temperature on a higher temperature side than a peak top temperature of the intrinsic peak appear in a DSC curve obtained...