ALEXANDRIA, Va., March 31 -- United States Patent no. 12,592,504, issued on March 31, was assigned to JESS-LINK PRODUCTS Co. LTD. (New Taipei City, Taiwan).
"Bus connection wire forward soldering structure" was invented by Wen-Yu Wang (New Taipei City, Taiwan) and Chieh-Ming Cheng (New Taipei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bus connection wire forward soldering structure includes a circuit board, a flat cable and a fixing member, and the circuit board has a solder area, a docking area, first and second surfaces and an outgoing line direction. The solder area is disposed on the first surface, the flat cable includes a solder terminal, first and second attaching sections, a foldin...