ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,248, issued on Feb. 17, was assigned to JESS-LINK PRODUCTS Co. LTD. (New Taipei, Taiwan).
"Cooling device" was invented by Chi-Hsien Sun (New Taipei, Taiwan) and Pei-Fang Wu (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cooling device includes a tungsten alloy cooling pad (10), a first substrate (20), a second substrate (30) and multiple connecting columns (40). The tungsten alloy cooling pad (10) is used for being attached on the heat source (H). The first substrate (20) is parallelly superposed on the tungsten alloy cooling pad (10). The second substrate (30) corresponds to the first substrate (20) to be parallelly arranged....