ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,554, issued on June 30, was assigned to Jentech Precision Industrial Co. LTD. (Taoyuan City, Taiwan).
"Package structure and method of manufacturing the same" was invented by Chin-Jui Yu (Taoyuan City, Taiwan), Jheng-Dong Huang (Taoyuan City, Taiwan), Yin-Hsien Yang (Taoyuan City, Taiwan) and Jian-Tsai Chang (Taoyuan City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure and a method of manufacturing the same are provided. The method of manufacturing the package structure includes several steps as follows. A lead frame is provided. A first mask layer is formed on an upper surface of the lead frame and a second mask layer is ...