US Patent Issued to JCET Management on April 21 for "Semiconductor package injection molding mold, injection molding device and semiconductor package injection molding method" (Chinese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,868, issued on April 21, was assigned to JCET Management Co. Ltd. (Shanghai City, China).

"Semiconductor package injection molding mold, injection molding device and semiconductor package injection molding method" was invented by Cheng Yang (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to the technical field of chip package, in particular to a semiconductor package injection molding mold, a semiconductor package injection molding device and a semiconductor package injection molding method. The semiconductor package injection molding mold includes a bottom mold and a top mold. The upper surface of the bottom ...