US Patent Issued to JCET GROUP on Feb. 10 for "Package structure with inductor, and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,261, issued on Feb. 10, was assigned to JCET GROUP Co. LTD. (Jiangsu, China).

"Package structure with inductor, and manufacturing method thereof" was invented by Yaojian Lin (Wuxi, China), Chenye He (Wuxi, China), Shuo Liu (Wuxi, China), Danfeng Yang (Wuxi, China) and Li Zou (Wuxi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a package structure with an inductor and a manufacturing method thereof, the inductor and the interconnection component are used as n second package module, and stacked with other components such as the first package module to form a stack-like package structure. The first package module i...