US Patent Issued to JCET GROUP on Aug. 18 for "Fan-out packaging structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,929, issued on Aug. 18, was assigned to JCET GROUP Co. LTD (Wuxi City, China).

"Fan-out packaging structure and manufacturing method thereof" was invented by Yaojian Lin (Wuxi City, China), Danfeng Yang (Wuxi City, China), Shuo Liu (Wuxi City, China) and Shasha Zhou (Wuxi City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a fan-out packaging structure and a manufacturing method thereof. The packaging structure includes a redistribution layer, at least one plastic packaging layer, at least one first shielding layer, at least one chip, and at least one electrical connector. The redistribution layer includes a gro...