US Patent Issued to JAPAN ELECTRONIC MATERIALS on July 14 for "Composite probe, method for attaching probe, and method for manufacturing probe card" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,047, issued on July 14, was assigned to JAPAN ELECTRONIC MATERIALS Corp. (Hyogo, Japan).

"Composite probe, method for attaching probe, and method for manufacturing probe card" was invented by Kazuo Yokoyama (Hyogo, Japan), Masaya Inoue (Hyogo, Japan) and Yuusuke Miyagawa (Hyogo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "[Problem] The purpose of the present invention is to facilitate the insertion of a probe into two or more guide plates. [Solution] The present invention is provided with: a probe body 600 accommodated in a guide unit 30 for a probe card 1, the guide unit 30 comprising a first guide plate 301 and a second guide plate 302 di...