US Patent Issued to JAPAN ELECTRONIC MATERIALS on Feb. 10 for "Probe-card multilayer wiring substrate and probe card" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,803, issued on Feb. 10, was assigned to JAPAN ELECTRONIC MATERIALS Corp. (Hyogo, Japan).

"Probe-card multilayer wiring substrate and probe card" was invented by Satoshi Abe (Hyogo, Japan), Tetsuo Fujimoto (Hyogo, Japan), Yusuke Harada (Hyogo, Japan) and Shinya Hori (Hyogo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the present invention is to provide a multilayer wiring substrate for probe card capable of preventing deterioration of a thin film resistor 30. Provided is a multilayer wiring substrate (an ST substrate) 15 for probe card, the multilayer wiring substrate being provided on a wiring path between an external terminal ...