US Patent Issued to JAPAN ELECTRONIC MATERIALS on April 7 for "Alignment chip for probe card, probe card and probe card repair method" (Japanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,596,147, issued on April 7, was assigned to JAPAN ELECTRONIC MATERIALS Corp. (Hyogo, Japan).

"Alignment chip for probe card, probe card and probe card repair method" was invented by Takashi Yoshida (Hyogo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to provide an alignment chip for forming an alignment symbol on a wiring board of a probe card. Provided are: a substrate 51 having a pasting surface to be pasted to a probe installation surface 17 of a wiring board 14 constituting a probe card 10 via an adhesive 54; and an alignment symbol 501 made of a metal film 52 formed on a symbol surface on a side opposite to the pasting surface ...