US Patent Issued to Jabil on June 16 for "Method and apparatus for stacking printed circuit board assemblies with single reflow" (Malaysian Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,094, issued on June 16, was assigned to Jabil Inc. (St. Petersburg, Fla.).

"Method and apparatus for stacking printed circuit board assemblies with single reflow" was invented by Zambri Bin Samsudin (Penang, Malaysia) and Idris Bin Mansor (Penang, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein are implementations of methods and devices for stacking printed circuit board (PCB) assemblies (PCBA) with a single reflow process which decreases impact on surface mount technology (SMT) component and solder joint reliability."

The patent was filed on Sept. 13, 2021, under Application No. 18/245,024.

*For further information, inclu...