US Patent Issued to IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) on Jan. 13 for "Method and device for calculating thermal characteristics of building structure using artificial neural network" (South Korean Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,524,669, issued on Jan. 13, was assigned to IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) (Seoul, South Korea).

"Method and device for calculating thermal characteristics of building structure using artificial neural network" was invented by Hak-Sung Kim (Seoul, South Korea), Dug-Joong Kim (Seoul, South Korea), Sang-Il Kim (Seoul, South Korea) and Se-Min Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device for calculating thermal characteristics of a building structure using an artificial neural network comprise a first artificial neural network which receives first input information including a draw...