US Patent Issued to IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) on Feb. 24 for "Sealing structure and manufacturing method therefor" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,838, issued on Feb. 24, was assigned to IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY) (Seoul, South Korea).

"Sealing structure and manufacturing method therefor" was invented by Jin-Seong Park (Seongnam-si, South Korea), Ju-Hwan Han (Seoul, South Korea), Seong-Hyeon Lee (Busan, South Korea) and Seok-Goo Jeong (Goyang-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a sealing structure may comprise the steps of: providing a substrate in a chamber; forming a first material layer containing a silicon nitride (SiNx) on the substrate; and forming a second material layer containing a sili...