ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,109, issued on Sept. 1, was assigned to INVENTEC (PUDONG) TECHNOLOGY Corp. (Shanghai) and INVENTEC Corp. (Taipei City, Taiwan).
"Rack module and vibration reduction mechanism" was invented by Hsieh-Liang Tsai (Taipei City, Taiwan), Wen-Cheng Hu (Taipei City, Taiwan) and Chia Hung Lin (Taipei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A rack module includes a rack, a plurality of electronic devices and at least one vibration reduction mechanism. The electronic devices are disposed in the rack. The at least one vibration reduction mechanism is disposed in the rack and includes a casing and a weight distribution assembly disposed in th...