US Patent Issued to INV Polypropylene on April 14 for "Polymeric substrate including a barrier layer" (Texas Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,600,846, issued on April 14, was assigned to INV Polypropylene LLC (Wilmington, Del.).

"Polymeric substrate including a barrier layer" was invented by Billy R. Bodiford (Longview, Texas) and Ross Michael Mahan (Longview, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polymeric substrate is disclosed. The polymeric substrate comprises a barrier layer including a polymeric material comprising about 50 wt. % or more of at least one polyolefin polymer and 50 wt. % or less of a hydrocarbon resin. The polymeric material exhibits a DTUL of 30deg C. or more and a tensile modulus of 500 MPa or more and/or a flexural secant modulus of 500 MPa or more. Th...