US Patent Issued to International Business Machines on Sept. 1 for "Microelectronic structure comprising logic device and passive device with thinner Si layer" (New York, Vermont Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,252, issued on Sept. 1, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Microelectronic structure comprising logic device and passive device with thinner Si layer" was invented by Ruilong Xie (Niskayuna, N.Y.), Lawrence A. Clevenger (Saratoga Springs, N.Y.), Kisik Choi (Watervliet, N.Y.) and Terence Hook (Jericho Center, Vt.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic structure including a logic device and a passive device. The passive device includes a doped substrate, a silicide layer located on a backside surface of the doped substrate, and a metal plane located on a backside surface of the silicide lay...