US Patent Issued to INTERNATIONAL BUSINESS MACHINES on March 24 for "Forming wrap around contact with self-aligned backside contact" (Utah, New York Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,277, issued on March 24, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"Forming wrap around contact with self-aligned backside contact" was invented by Shravana Kumar Katakam (Lehi, Utah), Tao Li (Slingerlands, N.Y.), Ruilong Xie (Niskayuna, N.Y.) and Nicholas Anthony Lanzillo (Wynantskill, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "One or more systems, devices, and/or methods of fabrication provided herein relate to reduced resistance between contacts and source/drain epis. According to one embodiment, a semiconductor device can comprise a source/drain region comprising a top portion, a sidewall portion and a botto...