US Patent Issued to International Business Machines on March 17 for "Multistack metal-insulator-metal (MIM) structure using spacer formation process for heterogeneous integration with discrete capacitors" (New York Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,667, issued on March 17, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Multistack metal-insulator-metal (MIM) structure using spacer formation process for heterogeneous integration with discrete capacitors" was invented by Joshua M. Rubin (Albany, N.Y.) and Christopher J. Penny (Saratoga Springs, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-stack metal-insulator-metal (MIM) structure includes a plurality of conductive plates including a first group comprising odd-numbered ones of the plates and a second group comprising even-numbered ones of the plates. All of the conductive plates are of an identical materia...