US Patent Issued to International Business Machines on June 16 for "Symmetric multi-IC modules using hierarchical digital reconfiguration of integrated circuit chips" (New York, New Jersey Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,658,561, issued on June 16, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Symmetric multi-IC modules using hierarchical digital reconfiguration of integrated circuit chips" was invented by Bodhisatwa Sadhu (Peekskill, N.Y.), Mark Yeck (Bloomingdale, N.J.) and Arun Paidimarri (White Plains, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit comprises a set of ports of a first type arranged symmetrically about an axis of symmetry of the circuit, and a digital reassigner configured to reassign an original port of the set of ports to a reassigned port of the set of ports located on an opposite side of the axis of symmetry...