US Patent Issued to International Business Machines on Jan. 27 for "Embedded sensor chips in 3D and 4D printed structures through selective filament infusion" (Texas, North Carolina, New York Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,535,796, issued on Jan. 27, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Embedded sensor chips in 3D and 4D printed structures through selective filament infusion" was invented by Jeremy R. Fox (Georgetown, Texas), Martin G. Keen (Cary, N.C.), Alexander Reznicek (Troy, N.Y.) and Bahman Hekmatshoartabari (White Plains, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method, computer program, and computer system are provided for enabling chip-infused filament for 3D printing. A structure to be formed through 3D printing is identified. A type associated with one or more sensors embedded in a polymer filament and a location a...