US Patent Issued to International Business Machines on Feb. 24 for "Selective deposition and cross-linking of polymeric dielectric material" (New York, California Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,980, issued on Feb. 24, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Selective deposition and cross-linking of polymeric dielectric material" was invented by Cornelius Brown Peethala (Slingerlands, N.Y.), Rudy J. Wojtecki (San Jose, Calif.), Son Nguyen (Schenectady, N.Y.) and Balasubramanian S. Pranatharthiharan (Watervliet, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An exemplary semiconductor structure includes a semiconductor substrate; a plurality of metal lines on top of the semiconductor substrate, each line having a line width 5 nanometers or less: a plurality of dielectric features adjacent to the metal line...