US Patent Issued to International Business Machines on Feb. 17 for "Semiconductor structure with fully wrapped-around backside contact" (New York Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,356, issued on Feb. 17, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Semiconductor structure with fully wrapped-around backside contact" was invented by Ruilong Xie (Niskayuna, N.Y.), Chanro Park (Clifton Park, N.Y.), Min Gyu Sung (Latham, N.Y.), Kangguo Cheng (Schenectady, N.Y.) and Julien Frougier (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a backside contact, and a source/drain region fully disposed within the backside contact."

The patent was filed on Oct. 17, 2022, under Application No. 17/967,016.

*For further information, including images, charts and tables, pleas...