ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,351, issued on Feb. 10, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Diffusion break between passive device and logic device with backside contact" was invented by Tao Li (Slingerlands, N.Y.), Ruilong Xie (Niskayuna, N.Y.), Kisik Choi (Watervliet, N.Y.) and John Christopher Arnold (North Chatham, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of present invention provide a method of forming a semiconductor structure. The method includes forming a passive device area and a logic device area on a substrate; forming a diffusion break between the passive device area and the logic device area, wherein the diffus...