US Patent Issued to INTERNATIONAL BUSINESS MACHINES on Dec. 16 for "High density interconnects for arrays of Josephson traveling wave parametric devices" (New York Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,841, issued on Dec. 16, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.).

"High density interconnects for arrays of Josephson traveling wave parametric devices" was invented by Corrado P. Mancini (Hopewell Junction, N.Y.) and David Lokken-Toyli (White Plains, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A superconducting electrical device includes one or more traveling-wave parametric amplifiers (TWPAs) on a chip that is electrically connected to a wiring layer of a substrate. The electrical connection of the chip to the wiring layer of the substrate includes, for each of the one or more TWPAs, a signal bump-bond between t...